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Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold

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Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold

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Brand Name : Bicheng

Model Number : BIC-2.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Based material : Rogers 4350

PCB thickness : 6.6 mil

PCB size : ≤400mm X 500mm

Surface : Gold

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Rogers 4350 Dual layer 6.6 mil High frequency PCB with Immersion Gold

The qualities required by designers of RF microwave circuits, matching networks, and controlled impedance transmission lines are present in the material RO4350B. Since standard circuit board materials cannot be used in many applications due to higher operating frequencies, low dielectric loss makes it possible to employ RO4350B material in these applications.

The dielectric constant is consistent across a wide frequency range and has one of the lowest temperature coefficients of any circuit board material.

Main applications:

Low Noise Block

Power amplifiers

RFID

RO4350B Typical Value
Property RO4350B Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037
0.0031		 Z 10 GHz/23℃
2.5 GHz/23℃		 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 x 1010 MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 x109 MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 16,767(2,432)
14,153(2,053)		 X
Y		 MPa(ksi) RT ASTM D 638
Tensile Strength 203(29.5)
130(18.9)		 X
Y		 MPa(ksi) RT ASTM D 638
Flexural Strength 255
(37)		 MPa
(kpsi)		 IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mil/inch)		 after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
32		 X
Y
Z		 ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280 ℃ TMA A IPC-TM-650 2.4.24.3
Td 390 ℃ TGA ASTM D 3850
Thermal Conductivity 0.69 W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06 % 48hrs immersion 0.060"
sample Temperature 50℃		 ASTM D 570
Density 1.86 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88
(5.0)		 N/mm
(pli)		 after solder float 1 oz.
EDC Foil		 IPC-TM-650 2.4.8
Flammability (3)V-0 UL 94
Lead-free Process Compatible Yes

Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold


Product Tags:

Dual Layer High Frequency PCB

      

6.6 Mil High Frequency PCB

      

Immersion Gold Two Layer Pcb

      
Quality Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold for sale

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